Sign In | Join Free | My wpc-board.com
China WUXI WANLI ADHESION MATERIALS CO., LTD. logo
WUXI WANLI ADHESION MATERIALS CO., LTD.
Bond the world together
Verified Supplier

4 Years
Home > PUR Hot Melt Adhesives >

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Product Categories
WUXI WANLI ADHESION MATERIALS CO., LTD.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Brand Name : WANLI-ADHESION

Model Number : PUR-XBB768

Certification : ISO9001 ISO14001 IATF16949

Place of Origin : CHINA

MOQ : 20 KG

Payment Terms : L/C, T/T

Delivery Time : 5-8 work days

Packaging Details : 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel

Product : PUR Hot Melt Adhesive

Component : PUR (Polyurethane)

Appearance : Ivory White Solid

Solid Content : 100%

Shelf Life : 6 Months

Melt Viscosity : About 55000mPa·s@120℃

Operating Temperature : 120~140 ℃

Open Time : 8~15s@25℃

Useage Scope : Edge Bonding of Wood Materials- Chip Board

Application Industry : Woodworking Edgebanding

Contact Now

Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.


Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.

APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance Ivory White Solid
Component PUR (Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity About 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time 8~15s@25℃
Usage Scope Edge Bonding of Wood Materials - Chip Board
Shelf Life 6 Months
Package 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel


FEATURE
Very good initial adhesion.
Suitable opening time.
High final bonding strength.

USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.

STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768


Product Tags:

edgebanding low temperature hot melt glue

      

chip low temperature hot melt glue

      

white polypropylene hot glue

      
Wholesale Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from china suppliers

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: WUXI WANLI ADHESION MATERIALS CO., LTD.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like